SOLUTIONS
ELECTRONIC SYSTEM
High-Mix & Low to Medium Volume Assemblies
We have an infrastructure that is suitable for the production of cards in small quantities, which contain dense components and are designed to function with high reliability even under difficult environmental conditions.
Our testing infrastructure:
- Various automatic test devices for functional tests
- Development of the required test environment and interface hardware and software
- Electrical test device (flying probe)
- ESS tester (simultaneous temperature, humidity and vibration tests)
Our production infrastructure:
- High-speed SMT machine
- Fully automated assembly line
- Assembly of BGA, uBGA, CSP, CGA and 01005 integrated circuits with a leg pitch of 0.3 mm/12 mil
- Possibility of double-sided assembly of an electronic circuit board
- Oven with 7 temperature zones
- Selective surface soldering machine
- Automatic optical inspection device
- X-ray inspection
- Conformal coating
- Forming and bonding
- Sealing applications
- Production and quality control according to IPC-610 Class-3
FEATURED PROJECTS and WORKS
- High-Tech Production of Electronic Cards
- Modernization
- Electromechanical Integration and Internal Layout Design Shelter
- Integrated Platform Management System (IPMS)
- Production of Console Hardware
- Production of Cabinet Hardware
- Military Touchscreen Computer