AYESAŞ - ELECTRONICS ASSEMBLIES

CAPABILITIES AND INFRASTRUCTURE

AYESAŞ has an 1,500 m2 (16,000 sq.ft.) environmentally controlled area for 
•Circuit Card Assembly (CCA) / Printed Circuit Board Assemblies (PCBAs), 
•RF Assemblies, 
•Modules,
•LRU level electronics assemblies.
Electronics assembly operations are focused on mid-low production volume and high complexity products that must perform reliably in extreme and high-cost-of-failure environments.

Manufacturing infrastructure involves:
•High-speed SMT 
•Fine pitch down to 0.3mm/12 mil, BGA, uBGA, CSP and CGA, and 01005 chip devices
•Single- and double-sided SMT and Through-hole runs 
•High-temperature 7-zone nitrogen reflow

•Inline paste inspection
•Fully automated selective solder 
•Automated Optical Inspection (AOI) 
•X-ray Inspection
•Conformal coating 
•Dispenser applications
•Sealing  
•Production and quality Inspection to IPC-610 Class 3

Testing infrastructure involves:
•Functional Testing via ATE
•Flying Probe
•Environmental stress screening, including temperature, humidity and 3-axis vibration testing

SOLUTIONS